| 2nd Level Interconnect |
e4 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Class |
AB |
| Die Technology |
LDMOS |
| Export Control Classification Number (US) |
5A991 |
| Frequency (Max) (MHz) |
2170 |
| Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Micron Size (μm) |
6 |
| Pin/Lead/Ball Count |
2 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
N |
| Supply Voltage (Typ) (V) |
28 |
| Matching |
I/O |
| P1dB (Typ) (W) |
100 |
| Test Signal |
W-CDMA |
| Last Order Date |
03 Oct 2008 |
| Last Ship Date |
14 May 2009 |
| Halogen Free |
Yes |
| Intermodulation Distortion - IM3 (Typ) (dBc) |
-37 |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
40 |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| Description |
HV5 LDMOS WCDMA NI880 |
| Package Width (nominal) (mm) |
.540 |
| Thermal Resistance (Spec) (°CW) |
0.44 |
| Budgetary Price($US) |
- |
| Status |
No Longer Manufactured |
| Tape & Reel |
Yes |
| Part Number |
MRF5S21130HSR3 |
| Device Weight (g) |
6.75760 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Package Length (nominal) (mm) |
.900 |
| Package Thickness (nominal) (mm) |
.200 |
| Package Description and Mechanical Drawing |
NI-880S |
| Efficiency (Typ) (%) |
26 |
| Power Gain (Typ) (dB) @ f (MHz) |
13.5 @ 2170 |
| Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
28 @ AVG |
| Device Sample Availability |
09 Jun 2006 |
| Device Production Availability |
09 Jun 2006 |