Part Number |
MRF6P23190HR6 |
2nd Level Interconnect |
e4 |
Class |
AB |
Package Description and Mechanical Drawing |
NI-1230 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Device Weight (g) |
13.19260 |
Material Type |
Tested Packaged Device |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
40 @ AVG |
POQ Container |
REEL |
Die Technology |
LDMOS |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
Sample Exception Availability |
N |
Description |
HV6 2.3GHZ 40W NI1230H W-CDMA |
Package Length (nominal) (mm) |
41.150 |
Package Thickness (nominal) (mm) |
4.450 |
Power Gain (Typ) (dB) @ f (MHz) |
14 @ 2300 / 14 @ 2400 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Pin/Lead/Ball Count |
5 |
Last Order Date |
27 Jun 2012 |
Efficiency (Typ) (%) |
23.5 |
Frequency Band (Min-Max) (MHz) |
2300 to 2400 |
Halogen Free |
Yes |
Status |
No Longer Manufactured |
Minimum Package Quantity (MPQ) |
150 |
Supply Voltage (Typ) (V) |
28 |
REACH SVHC |
Freescale REACH Statement |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Budgetary Price($US) |
- |
Device Sample Availability |
21 Jun 2011 |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Last Ship Date |
27 Jun 2013 |
Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
Export Control Classification Number (US) |
EAR99 |
Device Production Availability |
21 Jun 2011 |
Intermodulation Distortion - IM3 (Typ) (dBc) |
-37.5 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
6 |
Package Width (nominal) (mm) |
10.160 |
Test Signal |
W-CDMA |
Maximum Time at Peak Temperature (s) |
40 |
P1dB (Typ) (W) |
190 |
Tape & Reel |
Yes |
Thermal Resistance (Spec) (°CW) |
0.24 |
Frequency (Max) (MHz) |
2400 |
Matching |
I/O |
Preferred Order Quantity (POQ) |
150 |