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MRF9045NR1

厂商:
Freescale
类别:
RF功率晶体管
包装:
-
封装:
TO-270-2
无铅情况/ROHS:
无铅
描述:
45W 1GHZ RF LDMOS TO270N

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  • 参数
  • 描述
  • 文档
参数 数值
2nd Level Interconnect e3
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Class AB
Die Technology LDMOS
Export Control Classification Number (US) 5A991
Frequency (Max) (MHz) 945
Frequency Band (Min-Max) (MHz) 945 to 945
Harmonized Tariff (US) Disclaimer 8541.29.0075
Life Cycle Description (code) NOT RECOMMENDED(DECLINING)
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Micron Size (μm) .4
Pin/Lead/Ball Count 3
RoHS Certificate of Analysis (CoA) Contact Us
Sample Exception Availability N
Supply Voltage (Typ) (V) 28
Minimum Package Quantity (MPQ) 500
POQ Container BOX
Floor Life 168 HOURS
Matching Unmatched
Moisture Sensitivity Level (MSL) 3
P1dB (Typ) (W) 45
Test Signal 2-Tone
Leadtime (weeks) 8
Package Material Plastic
Mounting Style Surface Mount
Wideband Efficiency (Typ) (%) 41
Wideband Frequency (Min-Max) (MHz) (f) 450 to 1000
Intermodulation Distortion - IMD (Typ) (dBc) -31
Material Type Tested Packaged Device
Maximum Time at Peak Temperature (s) 40
MPQ Container REEL
Number of Reflow Cycles 3
REACH SVHC Freescale REACH Statement
RoHS technical exemption(s) 7a
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Description 45W 1GHZ RF LDMOS TO270N
Package Width (nominal) (mm) .240
Preferred Order Quantity (POQ) 500
Thermal Resistance (Spec) (°CW) 0.85
Budgetary Price($US) -
Status Not Recommended for New Design
Tape & Reel Yes
Part Number MRF9045NR1
Device Weight (g) .52955
Peak Package Body Temperature (PPT)(°C) 260
Package Length (nominal) (mm) .380
Package Thickness (nominal) (mm) .084
Package Description and Mechanical Drawing TO-270-2
Pb-Free No
Efficiency (Typ) (%) 41
Power Gain (Typ) (dB) @ f (MHz) 19 @ 945
Output Power (Typ) (W) @ Intermodulation Level at Test Signal 45 @ PEP
Device Sample Availability 13 Mar 2007
Device Sample Availability 27 Jan 2005
Device Production Availability 13 Mar 2007
Device Production Availability 27 Jan 2005
进口全新原装
Application Notes
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