Micron Size (μm) |
6 |
Preferred Order Quantity (POQ) |
50 |
Package Thickness (nominal) (mm) |
3.760 |
POQ Container |
BOX |
Device Sample Availability |
21 Jun 2011 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Minimum Package Quantity (MPQ) |
50 |
Thermal Resistance (Spec) (°CW) |
0.36 |
Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
P1dB (Typ) (W) |
130 |
Package Width (nominal) (mm) |
9.780 |
Status |
No Longer Manufactured |
2nd Level Interconnect |
e4 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
56 @ AVG |
Test Signal |
W-CDMA |
Last Order Date |
27 Jun 2012 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Halogen Free |
Yes |
Package Description and Mechanical Drawing |
NI-780 |
Pin/Lead/Ball Count |
3 |
Matching |
I/O |
Power Gain (Typ) (dB) @ f (MHz) |
17.9 @ 1990 |
Budgetary Price($US) |
- |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
REACH SVHC |
Freescale REACH Statement |
Description |
HV6 1.9GHZ 56W 28V NI780 |
Device Production Availability |
21 Jun 2011 |
Device Weight (g) |
6.42500 |
Maximum Time at Peak Temperature (s) |
40 |
Tape & Reel |
Yes |
MPQ Container |
REEL |
Die Technology |
LDMOS |
Efficiency (Typ) (%) |
29.5 |
Frequency Band (Min-Max) (MHz) |
1930 to 1990 |
Material Type |
Tested Packaged Device |
Number of Reflow Cycles |
3 |
Package Length (nominal) (mm) |
34.040 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Sample Exception Availability |
N |
Part Number |
MRF6S19200HR5 |
Export Control Classification Number (US) |
EAR99 |
Frequency (Max) (MHz) |
1990 |
Last Ship Date |
27 Jun 2013 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Class |
AB |
Supply Voltage (Typ) (V) |
28 |