| 2nd Level Interconnect |
e3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Class |
AB |
| Die Technology |
LDMOS |
| Export Control Classification Number (US) |
EAR99 |
| Frequency (Max) (MHz) |
2170 |
| Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
| Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
| Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Micron Size (μm) |
.37 |
| Pin/Lead/Ball Count |
5 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
N |
| Supply Voltage (Typ) (V) |
28 |
| Minimum Package Quantity (MPQ) |
500 |
| POQ Container |
REEL |
| Floor Life |
168 HOURS |
| Matching |
I/O |
| Moisture Sensitivity Level (MSL) |
3 |
| P1dB (Typ) (W) |
45 |
| Test Signal |
W-CDMA |
| Package Material |
Plastic |
| Mounting Style |
Surface Mount |
| Last Order Date |
01 Jul 2011 |
| Last Ship Date |
30 Jun 2012 |
| Intermodulation Distortion - IM3 (Typ) (dBc) |
-37 |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
40 |
| MPQ Container |
REEL |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS technical exemption(s) |
7a |
| Description |
2170MHZ 10W TO272WB4N |
| Package Width (nominal) (mm) |
9.020 |
| Preferred Order Quantity (POQ) |
500 |
| Thermal Resistance (Spec) (°CW) |
1.35 |
| Budgetary Price($US) |
- |
| Status |
No Longer Manufactured |
| Tape & Reel |
Yes |
| Part Number |
MRF5S21045NBR1 |
| Device Weight (g) |
1.91110 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Package Length (nominal) (mm) |
23.620 |
| Package Thickness (nominal) (mm) |
2.590 |
| Package Description and Mechanical Drawing |
TO-272 WB-4 |
| Pb-Free |
No |
| Efficiency (Typ) (%) |
25.5 |
| Power Gain (Typ) (dB) @ f (MHz) |
14.5 @ 2112.5 |
| Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
10 @ AVG |
| Device Sample Availability |
22 Feb 2005 |
| Device Sample Availability |
15 Jun 2010 |
| Device Production Availability |
22 Feb 2005 |
| Device Production Availability |
15 Jun 2010 |