Package Width (nominal) (mm) |
9.020 |
Part Number |
MRF5P21045NR1 |
Die Technology |
LDMOS |
Moisture Sensitivity Level (MSL) |
3 |
Package Thickness (nominal) (mm) |
2.590 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Device Weight (g) |
1.64635 |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Device Production Availability |
15 Jun 2010 |
Floor Life |
168 HOURS |
Material Type |
Tested Packaged Device |
Number of Reflow Cycles |
3 |
Pin/Lead/Ball Count |
5 |
Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Package Description and Mechanical Drawing |
TO-270 WB-4 |
POQ Container |
BOX |
Sample Exception Availability |
N |
Efficiency (Typ) (%) |
25.5 |
Intermodulation Distortion - IM3 (Typ) (dBc) |
-37 |
Mounting Style |
Surface Mount |
MPQ Container |
REEL |
Package Length (nominal) (mm) |
17.530 |
Tape & Reel |
Yes |
Leadtime (weeks) |
8 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Device Sample Availability |
15 Jun 2010 |
RoHS technical exemption(s) |
7a |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Description |
HV5 2170MHZ 10W TO270WB4 |
Micron Size (μm) |
.37 |
Preferred Order Quantity (POQ) |
500 |
Test Signal |
W-CDMA |
Status |
Active |
Matching |
I/O |
Maximum Time at Peak Temperature (s) |
40 |
Minimum Package Quantity (MPQ) |
500 |
P1dB (Typ) (W) |
45 |
Package Material |
Plastic |
REACH SVHC |
Freescale REACH Statement |
Class |
AB |
Export Control Classification Number (US) |
EAR99 |
Frequency (Max) (MHz) |
2170 |
Pb-Free |
No |
Power Gain (Typ) (dB) @ f (MHz) |
14.5 @ 2170 |
Supply Voltage (Typ) (V) |
28 |
Frequency Band (Min-Max) (MHz) |
2110 to 2170 |
2nd Level Interconnect |
e3 |
Budgetary Price($US) |
- |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
10 @ AVG |
Thermal Resistance (Spec) (°CW) |
1.48 |