Device Production Availability |
25 Jan 2005 |
MPQ Container |
REEL |
Package Width (nominal) (mm) |
9.780 |
Class |
AB |
Device Sample Availability |
16 Jun 2010 |
Frequency (Max) (MHz) |
860 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Efficiency (Typ) (%) |
23 |
Package Description and Mechanical Drawing |
NI-860C3 |
Test Signal |
OFDM |
Status |
No Longer Manufactured |
Frequency Band (Min-Max) (MHz) |
470 to 860 |
P1dB (Typ) (W) |
235 |
Device Production Availability |
16 Jun 2010 |
POQ Container |
REEL |
Preferred Order Quantity (POQ) |
250 |
Supply Voltage (Typ) (V) |
32 |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Last Order Date |
01 Jul 2011 |
Life Cycle Description (code) |
PRODUCT LAST SHIPMENTS |
Power Gain (Typ) (dB) @ f (MHz) |
18.2 @ 860 |
REACH SVHC |
Freescale REACH Statement |
Description |
250W 860MHZ 32V NI860MLH |
Device Weight (g) |
6.32440 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
2nd Level Interconnect |
e4 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Export Control Classification Number (US) |
5A991 |
Last Ship Date |
30 Jun 2012 |
Material Type |
Tested Packaged Device |
Number of Reflow Cycles |
3 |
Pin/Lead/Ball Count |
5 |
Thermal Resistance (Spec) (°CW) |
0.27 |
Device Sample Availability |
25 Jan 2005 |
Halogen Free |
Yes |
Package Length (nominal) (mm) |
34.040 |
Sample Exception Availability |
N |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
45 @ AVG |
Peak Package Body Temperature (PPT)(°C) |
260 |
Budgetary Price($US) |
- |
Minimum Package Quantity (MPQ) |
250 |
Matching |
I/O |
Maximum Time at Peak Temperature (s) |
40 |
Tape & Reel |
Yes |
Part Number |
MRF377HR3 |
Die Technology |
LDMOS |
Micron Size (μm) |
6 |
Package Thickness (nominal) (mm) |
5.130 |