Micron Size (μm) |
.4 |
Package Thickness (nominal) (mm) |
3.810 |
Device Production Availability |
26 Jul 2003 |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
P1dB (Typ) (W) |
75 |
Package Length (nominal) (mm) |
20.320 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
2nd Level Interconnect |
e4 |
Device Sample Availability |
13 Mar 2007 |
Last Ship Date |
30 Jun 2012 |
Description |
75W 860MHZ LDMOS NI360L |
Budgetary Price($US) |
- |
Frequency Band (Min-Max) (MHz) |
470 to 860 |
Status |
No Longer Manufactured |
Sample Exception Availability |
N |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Last Order Date |
01 Jul 2011 |
Maximum Time at Peak Temperature (s) |
40 |
Package Width (nominal) (mm) |
5.840 |
Power Gain (Typ) (dB) @ f (MHz) |
18.2 @ 860 |
Thermal Resistance (Spec) (°CW) |
0.89 |
Package Description and Mechanical Drawing |
NI-360 |
Tape & Reel |
Yes |
REACH SVHC |
Freescale REACH Statement |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Die Technology |
LDMOS |
Efficiency (Typ) (%) |
60 |
Material Type |
Tested Packaged Device |
Number of Reflow Cycles |
3 |
Supply Voltage (Typ) (V) |
32 |
Device Production Availability |
13 Mar 2007 |
Device Weight (g) |
2.93780 |
Matching |
Unmatched |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
75 @ CW |
Peak Package Body Temperature (PPT)(°C) |
260 |
Part Number |
MRF373ALR1 |
Export Control Classification Number (US) |
EAR99 |
Frequency (Max) (MHz) |
860 |
Halogen Free |
Yes |
Pin/Lead/Ball Count |
3 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Class |
AB |
Device Sample Availability |
26 Jul 2003 |
Test Signal |
1-Tone |