Thermal Resistance (Spec) (°CW) |
5.74 |
Part Number |
MRF281ZR1 |
Device Production Availability |
29 Dec 2005 |
Material Type |
Tested Packaged Device |
Micron Size (μm) |
.6 |
Supply Voltage (Typ) (V) |
26 |
Description |
RF PWR FET |
Halogen Free |
Yes |
Pin/Lead/Ball Count |
3 |
RoHS Certificate of Analysis (CoA) |
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Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Class |
A / AB |
Die Technology |
LDMOS |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Package Length (nominal) (mm) |
4.700 |
Budgetary Price($US) |
- |
Efficiency (Typ) (%) |
33 |
Frequency Band (Min-Max) (MHz) |
1930 to 2000 |
Intermodulation Distortion - IMD (Typ) (dBc) |
-31 |
Last Ship Date |
03 Oct 2009 |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Status |
No Longer Manufactured |
Last Order Date |
04 Apr 2009 |
REACH SVHC |
Freescale REACH Statement |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
4 @ PEP |
Package Thickness (nominal) (mm) |
2.540 |
Package Width (nominal) (mm) |
3.680 |
Tape & Reel |
Yes |
Frequency (Max) (MHz) |
2000 |
P1dB (Typ) (W) |
4 |
Package Description and Mechanical Drawing |
NI-200Z |
2nd Level Interconnect |
e4 |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
Device Weight (g) |
.13560 |
Export Control Classification Number (US) |
EAR99 |
Maximum Time at Peak Temperature (s) |
40 |
Device Sample Availability |
29 Dec 2005 |
Power Gain (Typ) (dB) @ f (MHz) |
12.5 @ 2000 |
Sample Exception Availability |
N |
Test Signal |
2-Tone |
Matching |
Unmatched |
Number of Reflow Cycles |
3 |
Peak Package Body Temperature (PPT)(°C) |
260 |