2nd Level Interconnect |
e4 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Class |
AB |
Die Technology |
LDMOS |
Export Control Classification Number (US) |
EAR99 |
Frequency (Max) (MHz) |
1990 |
Frequency Band (Min-Max) (MHz) |
1930 to 1990 |
Harmonized Tariff (US) Disclaimer |
8541.29.0075 |
Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Micron Size (μm) |
6 |
Pin/Lead/Ball Count |
5 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Sample Exception Availability |
Y |
Supply Voltage (Typ) (V) |
28 |
Minimum Package Quantity (MPQ) |
250 |
POQ Container |
BOX |
Matching |
I/O |
P1dB (Typ) (W) |
130 |
Test Signal |
W-CDMA |
Leadtime (weeks) |
8 |
Halogen Free |
Yes |
Material Type |
Tested Packaged Device |
Maximum Time at Peak Temperature (s) |
40 |
MPQ Container |
REEL |
Number of Reflow Cycles |
3 |
REACH SVHC |
Freescale REACH Statement |
Description |
HV7 1.9GHZ 40W NI780-4S |
Package Width (nominal) (mm) |
9.780 |
Preferred Order Quantity (POQ) |
250 |
Thermal Resistance (Spec) (°CW) |
0.36 |
Budgetary Price($US) |
- |
Status |
Active |
Tape & Reel |
Yes |
Part Number |
MD7P19130HSR3 |
Device Weight (g) |
6.46880 |
Peak Package Body Temperature (PPT)(°C) |
260 |
Package Length (nominal) (mm) |
20.570 |
Package Thickness (nominal) (mm) |
3.730 |
Package Description and Mechanical Drawing |
NI-780HS-4 |
Efficiency (Typ) (%) |
30 |
Power Gain (Typ) (dB) @ f (MHz) |
20 @ 1987.5 |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
40 @ AVG |
Device Sample Availability |
15 Jun 2010 |
Device Production Availability |
15 Jun 2010 |