增益 |
23dB |
频率 |
1.93GHz ~ 1.99GHz |
电源电压 |
26V |
电源电流 |
160mA |
RF类型 |
Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA |
Frequency Band (Min-Max) (MHz) |
1930 to 1990 |
Moisture Sensitivity Level (MSL) |
3 |
Package Width (nominal) (mm) |
23.620 |
Export Control Classification Number (US) |
5A991 |
Gain (Typ) (dB) |
23 |
Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
Minimum Package Quantity (MPQ) |
500 |
Pin/Lead/Ball Count |
16 |
Preferred Order Quantity (POQ) |
500 |
REACH SVHC |
Freescale REACH Statement |
Budgetary Price($US) |
- |
Efficiency (Typ) (%) |
20 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Matching |
I/O |
Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
Maximum Time at Peak Temperature (s) |
40 |
Wideband Frequency (Min-Max) (MHz) (f) |
1700 to 2300 |
Device Weight (g) |
1.91230 |
Frequency (Max) (MHz) |
1990 |
Pb-Free |
No |
Tape & Reel |
Yes |
Output Power (Typ) (W) (P1dB) |
30 |
P1dB (Typ) (W) |
30 |
RoHS technical exemption(s) |
7a |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Die Technology |
LDMOS |
Mounting Style |
Surface Mount |
Part Number |
MW5IC2030NBR1 |
Supply Voltage (Typ) (V) |
27 |
Description |
1.9GHZ RFIC TO272WBN |
2nd Level Interconnect |
e3 |
Class |
AB |
Device Sample Availability |
25 Mar 2011 |
MPQ Container |
REEL |
Package Length (nominal) (mm) |
9.020 |
Application |
GSM / W-CDMA / GSM EDGE / PHS |
Status |
Not Recommended for New Design |
Package Material |
Plastic |
POQ Container |
BOX |
Thermal Resistance (Spec) (°CW) |
1.75 |
Device Production Availability |
25 Mar 2011 |
Floor Life |
168 HOURS |
Package Description and Mechanical Drawing |
TO-272 WB-16 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Material Type |
Tested Packaged Device |
Wideband Efficiency (Typ) (%) |
45 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Leadtime (weeks) |
8 |
Package Thickness (nominal) (mm) |
2.590 |
Test Signal |
N-CDMA |
Output Power (Typ) (W) @ Intermodulation Level at Test Signal |
5 @ AVG |
Power Gain (Typ) (dB) @ f (MHz) |
23 @ 1960 |
Sample Exception Availability |
N |
Micron Size (μm) |
.37 |
Number of Reflow Cycles |
3 |
Peak Package Body Temperature (PPT)(°C) |
260 |