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MPC8358ZUADDEA

厂商：
Freescale
类别：
PowerQUICC II pro
包装：
Tray
封装：
TBGA740 37.5*37.5*1.69P1
无铅情况/ROHS：
有铅
描述：
8360 TBGA NON-ENCRP

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  • 参数
  • 描述
  • 文档
参数 数值
速度 266MHz
处理器类型 MPC83xx PowerQUICC II Pro 32-Bit
电压 1.2V
安装类型 Surface Mount
Co Processor Type QUICC
Halogen Free Yes
Mounting Style Surface Mount
Description 8360 TBGA NON-ENCRP
Cache (kByte) 32
Core: Operating Frequency Max (Max) (MHz) 266
Pin/Lead/Ball Count 740
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Device Production Availability 28 Apr 2007
Floor Life 168 HOURS
I/O Operating Voltage (Max) (V) 1.9
Material Type Tested Packaged Device
Moisture Sensitivity Level (MSL) 3
Number of Reflow Cycles 3
Package Thickness (nominal) (mm) 1.460
Export Control Classification Number (US) 5A992
Serial Interface - Type HDLC / I2C / SPI / UART / USB
Micron Size (μm) .13
Package Length (nominal) (mm) 37.500
Package Width (nominal) (mm) 37.500
Part Number MPC8358ZUADDEA
Maximum Time at Peak Temperature (s) 40
Minimum Package Quantity (MPQ) 21
Serial Interface - Number of Interfaces 1 / 1 / 2 / 1 / 1
Bus Frequency (Max) (MHz) 133
Device Type MPU
External Bus Interface Local / PCI
RoHS Certificate of Analysis (CoA) Contact Us
Core: Performance in MIPS 503
Ethernet 10 BaseT
Sample Exception Availability Y
RoHS Compliant No
Ambient Operating Temperature (Min-Max) (°C) 0 to 105
Leadtime (weeks) 8
POQ Container BOX
USB USB 2.0
32-bit Product Family Power Architecture
Core: Number of cores (Spec) 1
External Memory Supported DDR / DDR1 / DDR2 / DRAM / EPROM / SDRAM
Pb-Free No
Peak Package Body Temperature (PPT)(°C) 260
MPQ Container TRAY
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Communication Protocol Ethernet / ATM
Harmonized Tariff (US) Disclaimer 8542.31.0000
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Core: Type e300
Device Sample Availability 28 Apr 2007
Package Material Plastic
REACH SVHC Freescale REACH Statement
Budgetary Price($US) 100 @ $37.45 each
Core: Operating Voltage (Spec) (V) 1.2
Device Weight (g) 10.94970
Junction Operating Temperature (Max) (°C) 105
Life Cycle Description (code) PRODUCT RAPID GROWTH
Package Description and Mechanical Drawing TBGA740 37.5*37.5*1.69P1
Power Dissipation (Typ) (W) 2.5
Status Active
Junction Operating Temperature (Min) (°C) 0
Preferred Order Quantity (POQ) 210

Freescale Semiconductor's MPC8360E PowerQUICC II™ Pro family of integrated communications processors is a next-generation extension of the popular PowerQUICC II line containing cores built on Power Architecture technology. The MPC8360E family incorporates a next-generation communications engine, the QUICC™ Engine, supporting a wide range of protocols, including Gigabit Ethernet and OC-12 asynchronous transfer mode (ATM)/Packet over Sonet (POS). Additional enhancements include the e300 core (enhanced version of the 603e™ core with larger caches), scaling up to 667 MHz, a DDR memory controller and the integrated security engine.

The MPC8360E PowerQUICC II Pro communications processor's advanced features make it suitable for today's and tomorrow's wired and wireless access equipment, as well as small and medium enterprise networking equipment. Target applications include multitenant units (MTUs), digital subscriber line access multiplexers (DSLAMs), wireless basestations, multi and fixed subscriber access nodes, add/drop multiplexers and routers.

The MPC8358E processor, a member of the MPC8360E PowerQUICC II Pro family, is pin-compatible with the MPC8360E (TBGA only). The MPC8358E offers a cost-effective, low-power processing solution that meets the performance requirements for broadband access applications, such as small-to-medium enterprise (SME) routers, low-end DSLAMs and IP private automatic branch exchange (PABX) systems.

e300 System-on-a-Chip Platform
The MPC8358E PowerQUICC II Pro family is based on the e300 system-on-a-chip (SoC) platform. This makes it easy and fast to add or remove functional blocks and develop additional SoC-based family members for emerging markets. At the heart of the e300 SoC platform is Freescale's e300 core built on Power Architecture technology. The e300 core is an enhanced version of the 603e core used in previous-generation PowerQUICC II processors.

Enhancements include twice as much L1 cache (32 KB data cache and 32 KB instruction cache) with integrated parity checking and other performance-enhancing features. The e300 core is software-compatible with existing 603e core-based products.

Connectivity
The MPC8360E processor is designed to support a wide range of communications interfaces, such as MII, RMII, GMII, TBI, RTBI, NMSI, UTOPIA, POS and TDM. The DDR memory controller helps to ensure high-speed memory access and a local system bus operating up to 133 MHz. Additional system connectivity is supplied by dual UART, dual inter-integrated circuit (I2C), dual serial peripheral interface (SPI), PCI interfaces and Universal Serial Bus (USB) interface (USB 2.0 full-/low-speed compatible).

Integrated Security The MPC8360E and MPC8358E processors feature integrated security with the powerful integrated security engine derived from Freescale's security coprocessor product line. Integrated security supports DES, 3DES, MD-5, SHA-1, AES and ARC-4 encryption algorithms, as well as a public key accelerator and an on-chip random number generator. The integrated security engine is capable of single-pass encryption and authentication, as required by IPsec, the IEEE® 802.11i standard and other security protocols.

Typical Applications
DSL infrastructure
  • DSLAMs
  • MTUs
Add/drop multiplexers and digital cross connects

Multiservice access nodes (MSAN) 
Wireless infrastructure