| 速度 |
400MHz |
| 处理器类型 |
MPC83xx PowerQUICC II Pro 32-Bit |
| 电压 |
1.2V |
| 安装类型 |
Surface Mount |
| Cache (kByte) |
64 |
| Junction Operating Temperature (Min) (°C) |
0 |
| Minimum Package Quantity (MPQ) |
24 |
| Description |
8349 TBGA PB W/ ENCRYP |
| USB |
USB 2.0 |
| Bus Frequency (Max) (MHz) |
133 |
| Communication Protocol |
Ethernet |
| Package Thickness (nominal) (mm) |
1.450 |
| Power Dissipation (Max) (W) |
3.3 |
| RoHS Compliant |
No |
| Status |
Active |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 105 |
| Maximum Time at Peak Temperature (s) |
40 |
| Device Sample Availability |
06 Dec 2006 |
| External Bus Interface |
Local / PCI |
| Pb-Free |
No |
| REACH SVHC |
Freescale REACH Statement |
| Core: Operating Frequency Max (Max) (MHz) |
400 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Power Dissipation (Typ) (W) |
2.1 |
| Device Sample Availability |
06 Dec 2006 |
| Floor Life |
168 HOURS |
| Leadtime (weeks) |
12 |
| MPQ Container |
TRAY |
| Tape & Reel |
No |
| Part Number |
MPC8349EZUAGDB |
| Device Weight (g) |
9.28320 |
| External Memory Supported |
DDR1 / DDR2 / DRAM / EPROM / FLASH / SDRAM |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| 32-bit Product Family |
Power Architecture |
| Core: Number of cores (Spec) |
1 |
| Core: Performance in MIPS |
760 |
| I/O Operating Voltage (Max) (V) |
3.3 |
| Package Description and Mechanical Drawing |
TBGA 672 35*35*1.5P1.0 |
| POQ Container |
BOX |
| Device Type |
MPU |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Budgetary Price($US) |
100 @ $51.87 each |
| Core: Operating Voltage (Spec) (V) |
1.2 |
| Device Production Availability |
06 Dec 2006 |
| Ethernet |
1GBaseT |
| Export Control Classification Number (US) |
5A002 |
| Package Material |
Plastic |
| Preferred Order Quantity (POQ) |
120 |
| Sample Exception Availability |
Y |
| Material Type |
Tested Packaged Device |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Micron Size (μm) |
.13 |
| Mounting Style |
Surface Mount |
| Package Length (nominal) (mm) |
35.000 |
| Package Width (nominal) (mm) |
35.000 |
| Junction Operating Temperature (Max) (°C) |
105 |
| Pin/Lead/Ball Count |
672 |
| UL94 (plastics flammability test) |
HB: slow burning on a horizontal specimen burningrate < 76 mm/min for thickness < 3 mm |
| Core: Type |
e300 |
| Device Production Availability |
06 Dec 2006 |
| Security |
2 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |