| 速度 |
166MHz |
| 处理器类型 |
MPC82xx PowerQUICC II 32-bit |
| 电压 |
2.5V |
| 安装类型 |
Surface Mount |
| Part Number |
XPC8260VVHFBC |
| 2nd Level Interconnect |
e1 |
| Cache (kByte) |
32 |
| Device Type |
MPU |
| Package Description and Mechanical Drawing |
TBGA 480 37.5SQ*1.7P1.27 |
| Pin/Lead/Ball Count |
480 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| 32-bit Product Family |
Power Architecture |
| Co Processor Frequency (Max) (MHz) |
133 |
| Core: Operating Voltage (Spec) (V) |
2.5 |
| Export Control Classification Number (US) |
5A991 |
| I/O Operating Voltage (Max) (V) |
3.3 |
| POQ Container |
BOX |
| Tape & Reel |
No |
| Core: Performance in MIPS |
315.4 |
| Device Production Availability |
19 Jul 2005 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Sample Exception Availability |
N |
| Package Material |
Plastic |
| Core: Operating Frequency Max (Max) (MHz) |
166 |
| Core: Type |
603e |
| Device Sample Availability |
19 Jul 2005 |
| Device Weight (g) |
10.06085 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Budgetary Price($US) |
100 @ $115.13 each |
| Ethernet |
100 BaseT |
| Micron Size (μm) |
.3 |
| Mounting Style |
Surface Mount |
| Description |
PQ 2 HIP 3 NO-PB |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 105 |
| Co Processor Type |
CPM |
| Number of Reflow Cycles |
3 |
| Status |
Not Recommended for New Design |
| Maximum Height Above Board (mm) |
1.650 |
| Package Length (nominal) (mm) |
37.500 |
| Package Width (nominal) (mm) |
37.500 |
| REACH SVHC |
Freescale REACH Statement |
| Junction Operating Temperature (Max) (°C) |
105 |
| Leadtime (weeks) |
8 |
| MPQ Container |
TRAY |
| Preferred Order Quantity (POQ) |
105 |
| Serial Interface - Type |
Ethernet |
| Communication Protocol |
Ethernet |
| External Memory Supported |
SRAM / SDRAM / FLASH / EPROM / DRAM |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Type |
Tested Packaged Device |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Core: Number of cores (Spec) |
1 |
| Package Thickness (nominal) (mm) |
1.700 |
| Moisture Sensitivity Level (MSL) |
3 |
| Peak Package Body Temperature (PPT)(°C) |
245 |
| Power Dissipation (Typ) (W) |
2.62 |
| Floor Life |
168 HOURS |
| Maximum Time at Peak Temperature (s) |
30 |
| External Bus Interface |
60x / Local |
| Minimum Package Quantity (MPQ) |
21 |
| Power Dissipation (Max) (W) |
3.02 |