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MPC8270ZQMIBA

厂商:
Freescale
类别:
PowerQUICC II
包装:
Tray
封装:
FPBGA 516 27*27*1.25P1.0
无铅情况/ROHS:
有铅
描述:
POWER QUICC II HIP7A ZQ

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  • 参数
  • 描述
  • 文档
参数 数值
速度 333MHz
处理器类型 MPC82xx PowerQUICC II 32-bit
电压 1.5V
安装类型 Surface Mount
Part Number MPC8270ZQMIBA
Bus Frequency (Max) (MHz) 66
Package Material Plastic
Sample Exception Availability Y
Co Processor Type CPM
External Memory Supported EPROM / FLASH / SDRAM / SRAM / DRAM
Footprint (land pattern) PDF
Number of Reflow Cycles 3
Pin/Lead/Ball Count 516
POQ Container BOX
32-bit Product Family Power Architecture
Budgetary Price($US) 100 @ $37.57 each
Co Processor Frequency (Max) (MHz) 200
I/O Operating Voltage (Max) (V) 3.3
Internal RAM (kByte) 64
Maximum Height Above Board (mm) 2.550
RoHS Compliant No
Micron Size (μm) .13
Moisture Sensitivity Level (MSL) 3
Mounting Style Surface Mount
Tape & Reel No
UL94 (plastics flammability test) V0: burning stops within 10 seconds on a vertical specimen; no drips allowed
Cache (kByte) 32
Core: Operating Frequency Max (Max) (MHz) 266
Device Type MPU
RoHS Certificate of Analysis (CoA) Contact Us
External Bus Interface 60x / Local / PCI
Package Description and Mechanical Drawing FPBGA 516 27*27*1.25P1.0
Preferred Order Quantity (POQ) 400
Core: Number of cores (Spec) 1
Material Type Tested Packaged Device
Timers - Number of Timers 4
Communication Protocol UART / Transparent / SS7 / HDLC / GCI / Ethernet / BISYNC / AppleTalk / TDM / UTOPIA
Core: Performance in MIPS 505.4
Export Control Classification Number (US) 5A991
Floor Life 168 HOURS
Halogen Free Yes
Life Cycle Description (code) PRODUCT STABLE GROWTH/MATURITY
Maximum Time at Peak Temperature (s) 30
Ethernet 100 BaseT
REACH SVHC Freescale REACH Statement
Capture Symbol PDF
Device Sample Availability 08 Oct 2004
Application/Qualification Tier COMMERCIAL, INDUSTRIAL
Core: Operating Voltage (Spec) (V) 1.5
Device Weight (g) 4.63415
Total DMA Channels 30
Status Active
Minimum Package Quantity (MPQ) 40
Serial Interface - Type I2C / SPI / USB / MII / Ethernet
Timers - Size (bit) 16
USB USB 2.0
Harmonized Tariff (US) Disclaimer 8542.31.0000
I/O Pins 120
Material Composition Declaration (MCD) Download MCD Report Download MCD Report
Pb-Free No
Power Dissipation (Max) (W) 1.1
MPQ Container TRAY
Package Length (nominal) (mm) 27.000
Package Thickness (nominal) (mm) 2.250
Package Width (nominal) (mm) 27.000
Power Dissipation (Typ) (W) 1.05
Description POWER QUICC II HIP7A ZQ
Ambient Operating Temperature (Min-Max) (°C) 0 to 105
Device Production Availability 08 Oct 2004
Core: Type 603e
Device Production Availability 08 Oct 2004
Device Sample Availability 08 Oct 2004
Junction Operating Temperature (Max) (°C) 105
Leadtime (weeks) 8
Peak Package Body Temperature (PPT)(°C) 245

Introducing the next generation of PowerQUICC II™ processors: the MPC8270, MPC8275 and MPC8280.

Utilizing Freescale's HiPerMOS7 0.13-micron process technology, the next generation PowerQUICC II family offers a range of performance, feature enhancements and package options with lower power requirements. Ideal for wired and wireless infrastructure communications processing tasks, enhancements to the PowerQUICC II family offer system designers a high degree of integrated features and functionality and a compelling, proven architecture.

The next generation of PowerQUICC II processors is an optimum solution for integrated control and forwarding plane processing in high-end communications and networking equipment -- such as routers, DSLAMs, remote access concentrators, telecom switching equipment and cellular base stations. Combining extensive layer 2 functionality with control plane processing, Freescale's PowerQUICC II processors include a high-performance embedded 603e™ core built on Power Architecture technology, and a powerful RISC-based Communications Processor Module (CPM). The CPM off-loads peripheral tasks from the embedded Power Architecture core and provides support for multiple communications protocols including 10/100Mbps Ethernet, 155Mbps ATM and 256 HDLC channels. And, of course, the next generation PowerQUICC II devices retain full software compatibility with the PowerQUICC II family.

A range of performance and package options

Taking advantage of the 0.13-micron process, the next generation of PowerQUICC II devices offers significant performance increases and power savings over the current generation PowerQUICC II devices, with speeds of up to 450MHz and 300MHz in the core and CPM respectively at less than 2 watts. The new processors continue to enhance the PowerQUICC architecture's industry-leading ATM support, offering up to 2 UTOPIA ports with support for up to 31 PHYs per interface -- ideal for high-density DSLAM line cards.

The next generation of PowerQUICC II solutions also delivers support for USB, an on-target addition for high performance SOHO and CPE networking equipment. And unlike most other integrated communications processors in the market, the PowerQUICC architecture integrates two processing cores to handle specific tasks: the core built on Power Architecture technology and the RISC-based CPM -- enabling a balanced approach for systems by handling both high-level tasks and low-level communications all in one integrated device.

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Features

  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI/local bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII
  • Performance
    • 266 MHz CPU, 200 MHz CPM, 66 MHz bus
    • ~ 1W @ full performance, 1.5V
  • Technology
    • HIP7AP .13 micron, 3.3V I/O, 1.5V Core
    • 516 PBGA, 27x27mm, 1mm ball pitch
      • ZQ package has lead-bearing spheres
      • VR package is lead-free
  • 603e core with 16K inst and 16K data caches
  • 64-bit 60x bus, 32-bit PCI bus
  • 128K ROM, 32K IRAM, 32K DPRAM
  • Three FCCs for 10/100 Ethernet
  • 128 HDLC channels, 4 TDMs
  • 4 SCCs, 2 SMCs, SPI, I2C
  • Memory controller built from SDRAM, UPM, GPCM machines
  • New features -- USB, RMII

Brochures
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PWRARCHQIQSG
Errata
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8280CE
Product Briefs
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 QUICC_CODESPB
Application Notes
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2291
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2347
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2915
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2587
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2059
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2654
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2349
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2335
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2431
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2585
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2491
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2754
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN2922
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN3352
MPC8270ZQMIBAPDF下载 点击下载 点击下载 AN3966
Packaging Information
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 TBGAPRESPKG
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PBGAPRES
Data Sheets
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8280EC
Product Change Notices
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PCN11123
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PCN10367
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PCN12125
MPC8270ZQMIBAPDF下载 点击下载 点击下载 PCN9586
Fact Sheets
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8280FACT
Reference Manuals
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8280RM
MPC8270ZQMIBAPDF下载 点击下载 点击下载 G2CORERM
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC60XBUSRM
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8260ESS7UMAD
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPCFPE32B
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC8280RMAD
White Papers
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC826XSDRAMWP
Product Numbering Scheme
文档名称 文档类型 软件 描述
MPC8270ZQMIBAPDF下载 点击下载 点击下载 MPC82XXHIP7PNS