| 系列 |
i.MX23 |
| 核心处理器 |
ARM9 |
| 芯体尺寸 |
32-Bit |
| 速度 |
454MHz |
| RAM容量 |
8K x 32 |
| 程序存储器类型 |
ROM |
| 程序存储器容量 |
64KB (16K x 32) |
| 输入/输出数 |
95 |
| 振荡器型 |
External |
| 数据转换器 |
A/D 16x12b, D/A 1x10b |
| 连通性 |
EBI/EMI, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB |
| 工作电压 |
1 V ~ 2.1 V |
| 工作温度 |
-10°C ~ 70°C |
| 周边设备 |
DMA, I²S, LCD, POR, PWM, WDT |
| 32-bit Product Family |
i.MX |
| Ambient Operating Temperature (Min-Max) (°C) |
-10 to 70 |
| Cache (kByte) |
16 |
| Last Order Date |
10 May 2013 |
| MPQ Container |
TRAY |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Halogen Free |
Yes |
| POQ Container |
BRICK |
| Sample Exception Availability |
N |
| Last Ship Date |
10 May 2014 |
| Timers - Channels |
4 |
| USB |
USB 2.0 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Maximum Time at Peak Temperature (s) |
40 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Application/Qualification Tier |
COMMERCIAL |
| Moisture Sensitivity Level (MSL) |
3 |
| Package Thickness (nominal) (mm) |
1.280 |
| Pin/Lead/Ball Count |
169 |
| Timer Features |
Watchdog / PWM |
| Status |
Migration in Process. View PCN and Replacement Part |
| Core: Number of cores (Spec) |
1 |
| External Memory Supported |
DDR |
| Micron Size (μm) |
.09 |
| Part Number |
MCIMX233DJM4B |
| Device Sample Availability |
20 Apr 2012 |
| Floor Life |
168 HOURS |
| Internal RAM (kByte) |
32 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Number of Reflow Cycles |
3 |
| Preferred Order Quantity (POQ) |
880 |
| Timers - Size (bit) |
16 |
| Additional Features |
LCD Controller / Real-Time Clock / TouchScreen |
| Minimum Package Quantity (MPQ) |
176 |
| Serial Interface - Type |
UART / I2C / SPI |
| Budgetary Price($US) |
100 @ $5.33 each |
| Bus Frequency (Max) (MHz) |
454 |
| Export Control Classification Number (US) |
5A002 |
| Leadtime (weeks) |
13 |
| Description |
i.MX233 Commercial |
| Core: Type |
ARM9 |
| Package Description and Mechanical Drawing |
MAPBGA 169 11*11*1.4P0.8 |
| Material Type |
Tested Packaged Device |
| Package Width (nominal) (mm) |
11.000 |
| Serial Interface - Number of Interfaces |
3 / 1 / 1 |
| 2nd Level Interconnect |
e1 |
| Multimedia |
Image Pre- and Post-Processor |
| Package Length (nominal) (mm) |
11.000 |
| Device Production Availability |
20 Apr 2012 |
| Core: Operating Frequency Max (Max) (MHz) |
454 |
| Core: Operating Voltage (Spec) (V) |
1.4 |
| Device Weight (g) |
.28040 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Timers - Number of Timers |
1 |