系列 |
i.MX23 |
核心处理器 |
ARM9 |
芯体尺寸 |
32-Bit |
速度 |
454MHz |
RAM容量 |
8K x 32 |
程序存储器类型 |
ROM |
程序存储器容量 |
64KB (16K x 32) |
输入/输出数 |
64 |
振荡器型 |
External |
数据转换器 |
A/D 16x12b, D/A 1x10b |
连通性 |
EBI/EMI, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB |
工作电压 |
1 V ~ 2.1 V |
工作温度 |
-40°C ~ 85°C |
周边设备 |
DMA, I²S, LCD, POR, PWM, WDT |
Core: Operating Voltage (Spec) (V) |
1.4 |
Material Composition Declaration (MCD) |
Download MCD Report |
Package Description and Mechanical Drawing |
LQFP 128 14*14*1.4P0.4 |
REACH SVHC |
Freescale REACH Statement |
Part Number |
MCIMX233CAG4B |
Package Thickness (nominal) (mm) |
1.600 |
Pin/Lead/Ball Count |
128 |
Serial Interface - Number of Interfaces |
3 / 1 / 1 |
Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
Mounting Style |
Surface Mount |
Package Length (nominal) (mm) |
14.000 |
Package Width (nominal) (mm) |
14.000 |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
32-bit Product Family |
i.MX |
Tape & Reel |
No |
Device Weight (g) |
.53480 |
Export Control Classification Number (US) |
5A002 |
Leadtime (weeks) |
13 |
Serial Interface - Type |
UART / I2C / SPI |
Cache (kByte) |
16 |
Floor Life |
168 HOURS |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
MPQ Container |
TRAY |
RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
Budgetary Price($US) |
100 @ $5.21 each |
Package Material |
Plastic |
Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
Internal RAM (kByte) |
32 |
Maximum Time at Peak Temperature (s) |
40 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Reflow Cycles |
3 |
Preferred Order Quantity (POQ) |
450 |
Timers - Size (bit) |
16 |
Status |
Migration in Process. View PCN and Replacement Part |
Core: Number of cores (Spec) |
1 |
Halogen Free |
Yes |
Peak Package Body Temperature (PPT)(°C) |
260 |
POQ Container |
BRICK |
Description |
PMP Controller |
Bus Frequency (Max) (MHz) |
454 |
Core: Type |
ARM9 |
Micron Size (μm) |
.09 |
USB |
USB 2.0 |
2nd Level Interconnect |
e3 |
Material Type |
Tested Packaged Device |
External Memory Supported |
DDR |
Sample Exception Availability |
N |
Device Sample Availability |
20 Apr 2012 |
Last Ship Date |
10 May 2014 |
Timers - Channels |
4 |
Device Production Availability |
20 Apr 2012 |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Last Order Date |
10 May 2013 |
Minimum Package Quantity (MPQ) |
90 |
Timers - Number of Timers |
1 |