系列 |
i.MX1 |
核心处理器 |
ARM9 |
芯体尺寸 |
32-Bit |
速度 |
200MHz |
程序存储器类型 |
ROMless |
输入/输出数 |
110 |
振荡器型 |
External |
连通性 |
EBI/EMI, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB |
工作电压 |
1.7 V ~ 1.9 V |
工作温度 |
0°C ~ 70°C |
周边设备 |
DMA, I²S, LCD, POR, PWM, WDT |
Sample Exception Availability |
N |
Part Number |
MC9328MX1VH20 |
Export Control Classification Number (US) |
EAR99 |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
Material Composition Declaration (MCD) |
Download MCD Report |
Package Material |
Plastic |
32-bit Product Family |
i.MX |
Last Order Date |
30 Jun 2006 |
Tape & Reel |
No |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Last Ship Date |
31 Dec 2006 |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
Package Description and Mechanical Drawing |
MAPBGA 256 14*14*0.8P0.8 |
Package Width (nominal) (mm) |
14.000 |
Peak Package Body Temperature (PPT)(°C) |
240 |
RoHS Compliant |
No |
Mounting Style |
Surface Mount |
Micron Size (μm) |
.16 |
Device Weight (g) |
.50480 |
Pin/Lead/Ball Count |
256 |
REACH SVHC |
Freescale REACH Statement |
Description |
DRAGONBALL MX1 |
Package Length (nominal) (mm) |
14.000 |
Status |
Migration Complete. No Longer Manufactured. View PCN and Replacement Part |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
Pb-Free |
No |
Device Sample Availability |
11 Jan 2003 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Reflow Cycles |
3 |
Floor Life |
168 HOURS |
Maximum Time at Peak Temperature (s) |
30 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Material Type |
Tested Packaged Device |
Budgetary Price($US) |
- |
Device Production Availability |
11 Jan 2003 |
Package Thickness (nominal) (mm) |
1.600 |