Last Order Date |
31 Jul 2008 |
Material Composition Declaration (MCD) |
Download MCD Report |
Moisture Sensitivity Level (MSL) |
3 |
Description |
32BIT MCU,4K+3.5K RAM |
Additional Features |
QADC |
Micron Size (μm) |
.55 |
Last Ship Date |
01 Sep 2009 |
Package Description and Mechanical Drawing |
QFP 160 28*28*3.3P0.65 |
Sample Exception Availability |
N |
2nd Level Interconnect |
e3 |
Chip Selects |
12 |
Internal RAM (kByte) |
7.5 |
Peak Package Body Temperature (PPT)(°C) |
245 |
Device Production Availability |
31 Oct 2007 |
Device Sample Availability |
30 Sep 2007 |
Material Type |
Tested Packaged Device |
Package Length (nominal) (mm) |
28.000 |
Package Width (nominal) (mm) |
28.000 |
Part Number |
MC68336GCAB25 |
Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
Mounting Style |
Surface Mount |
Floor Life |
168 HOURS |
Maximum Time at Peak Temperature (s) |
30 |
Number of Reflow Cycles |
3 |
Package Thickness (nominal) (mm) |
3.850 |
RoHS Certificate of Analysis (CoA) |
Contact Us |
Export Control Classification Number (US) |
EAR99 |
Serial Interface - Type |
SCI / QSPI |
Tape & Reel |
No |
Timer Features |
TPU |
UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
A/D Converter - Channels |
16 |
Budgetary Price($US) |
- |
Bus Frequency (Max) (MHz) |
25 |
A/D Converter - Bits (bit) |
10 |
I/O Operating Voltage (Max) (V) |
5 |
Status |
No Longer Manufactured |
Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL, AUTOMOTIVE |
External Memory Supported |
SRAM |
I/O Pins |
18 |
Pin/Lead/Ball Count |
160 |
Package Material |
Plastic |
Timers - Channels |
16 |
Device Weight (g) |
5.56680 |
REACH SVHC |
Freescale REACH Statement |