| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 85 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Export Control Classification Number (US) |
3A991 |
| Floor Life |
168 HOURS |
| Life Cycle Description (code) |
PRODUCT STABLE GROWTH/MATURITY |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Material Type |
Tested Packaged Device |
| Maximum Time at Peak Temperature (s) |
40 |
| Micron Size (μm) |
.13 |
| Moisture Sensitivity Level (MSL) |
3 |
| Mounting Style |
Surface Mount |
| Package Material |
Plastic |
| Pin/Lead/Ball Count |
272 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Sample Exception Availability |
Y |
| Internal RAM (kByte) |
16 |
| Minimum Package Quantity (MPQ) |
40 |
| MPQ Container |
TRAY |
| POQ Container |
BOX |
| Leadtime (weeks) |
10 |
| 2nd Level Interconnect |
e1 |
| Junction Operating Temperature (Max) (°C) |
115 |
| Bus Frequency (Max) (MHz) |
66 |
| I/O Operating Voltage (Max) (V) |
3.3 |
| USB |
USB 1.1 |
| Ethernet |
10/100MbT Ethernet |
| External Memory Supported |
DDR / SDR |
| Device Type |
MPU |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Number of Reflow Cycles |
3 |
| REACH SVHC |
Freescale REACH Statement |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Package Thickness (nominal) (mm) |
2.650 |
| Preferred Order Quantity (POQ) |
400 |
| Device Weight (g) |
2.54520 |
| Package Description and Mechanical Drawing |
PBGAPGE 272 27SQ1.2P1.27 |
| Description |
HABANERO INDUS- PBFREE |
| Status |
Active |
| Budgetary Price($US) |
10000 @ $17.66 each |
| Part Number |
MPC5200CVR400B |
| Package Length (nominal) (mm) |
27.000 |
| Package Width (nominal) (mm) |
27.000 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Serial Interface - Number of Interfaces |
1 / 1 / 2 / 1 / 2 / 1 |
| Serial Interface - Type |
PCI V2.2 / USB / I2C / SPI / CAN / Ethernet |
| I/O Pins |
56 |
| Device Sample Availability |
01 Feb 2006 |
| Device Production Availability |
01 Feb 2006 |