| Floor Life |
168 HOURS |
| Number of Reflow Cycles |
3 |
| Package Description and Mechanical Drawing |
LQFP 144 20*20*1.4P0.5 |
| Internal RAM (kByte) |
96 |
| POQ Container |
BOX |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Part Number |
SCF5249LAG133 |
| Timers - Channels |
2 |
| Additional Features |
Flash Media Interface / PLL |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| Application/Qualification Tier |
COMMERCIAL |
| Device Type |
MPU |
| Moisture Sensitivity Level (MSL) |
3 |
| Export Control Classification Number (US) |
3A991 |
| Maximum Height Above Board (mm) |
1.600 |
| Package Length (nominal) (mm) |
20.000 |
| Bus Frequency (Max) (MHz) |
120 |
| Halogen Free |
Yes |
| I/O Operating Voltage (Max) (V) |
3.6 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Mounting Style |
Surface Mount |
| Package Width (nominal) (mm) |
20.000 |
| Sample Exception Availability |
N |
| Timer Features |
Reference Compare / Output Compare / Input Capture |
| A/D Converter - Bits (bit) |
12 |
| Device Production Availability |
11 Mar 2005 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Cache (kByte) |
8 |
| Serial Interface - Type |
UART / I2C / QSPI |
| Core: Operating Frequency Max (Max) (MHz) |
133 |
| Leadtime (weeks) |
8 |
| Preferred Order Quantity (POQ) |
600 |
| Timers - Number of Timers |
2 |
| Device Weight (g) |
1.31910 |
| Timers - Size (bit) |
16 |
| Description |
PB-FREE AMADEUS 133MHZ |
| A/D Converter - Channels |
4 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Maximum Time at Peak Temperature (s) |
40 |
| MPQ Container |
TRAY |
| Chip Selects |
4 |
| External Memory Supported |
SDRAM |
| Minimum Package Quantity (MPQ) |
300 |
| Package Material |
Plastic |
| REACH SVHC |
Freescale REACH Statement |
| Core: Performance in MIPS |
125 |
| I/O Pins |
34 |
| Material Type |
Tested Packaged Device |
| Micron Size (μm) |
.18 |
| Serial Interface - Number of Interfaces |
2 / 1 / 1 |
| Status |
Not Recommended for New Design |
| 2nd Level Interconnect |
e3 |
| Budgetary Price($US) |
- |
| Device Sample Availability |
11 Mar 2005 |
| Package Thickness (nominal) (mm) |
1.600 |
| Pin/Lead/Ball Count |
144 |
| Total DMA Channels |
4 |