| Part Number |
MC68SEC000AA16 |
| POQ Container |
BRICK |
| Device Weight (g) |
.91160 |
| Status |
Not Recommended for New Design |
| 2nd Level Interconnect |
e3 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Chip Selects |
12 |
| Material Type |
Tested Packaged Device |
| Micron Size (μm) |
.65 |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| Timer Features |
Input Capture / Output Compare / Pulse Accumulator / Periodic Interrupt Timer (PIT) |
| Description |
8/16/32 BIT MPU, STATIC |
| Floor Life |
168 HOURS |
| Halogen Free |
Yes |
| Leadtime (weeks) |
12 |
| Budgetary Price($US) |
10000 @ $5.24 each |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| MPQ Container |
TRAY |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Total DMA Channels |
2 |
| Device Sample Availability |
29 Mar 2005 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Package Material |
Plastic |
| Minimum Package Quantity (MPQ) |
84 |
| Package Thickness (nominal) (mm) |
2.450 |
| REACH SVHC |
Freescale REACH Statement |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Core: Operating Frequency Max (Max) (MHz) |
20 |
| Device Production Availability |
29 Mar 2005 |
| Life Cycle Description (code) |
NOT RECOMMENDED(DECLINING) |
| Maximum Time at Peak Temperature (s) |
40 |
| Package Description and Mechanical Drawing |
QFP 64 14*14*2.2P0.8 |
| Serial Interface - Type |
SCI / QSPI |
| Export Control Classification Number (US) |
EAR99 |
| I/O Operating Voltage (Max) (V) |
5 |
| Preferred Order Quantity (POQ) |
420 |
| I/O Pins |
22 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Package Length (nominal) (mm) |
14.000 |
| Package Width (nominal) (mm) |
14.000 |
| Additional Features |
COP |
| Mounting Style |
Surface Mount |
| Pin/Lead/Ball Count |
64 |
| Sample Exception Availability |
N |