| Status |
No Longer Manufactured |
| Material Type |
Tested Packaged Device |
| Number of Reflow Cycles |
3 |
| 2nd Level Interconnect |
e3 |
| Floor Life |
UNLIMITED |
| Last Ship Date |
31 May 2012 |
| RoHS technical exemption(s) |
7c-I |
| Halogen Free |
Yes |
| Pb-Free |
No |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| Last Order Date |
15 Jan 2011 |
| Package Material |
Ceramic |
| Package Thickness (nominal) (mm) |
3.170 |
| Part Number |
MC68030FE33C |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Cache (kByte) |
0.512 |
| Micron Size (μm) |
.8 |
| Mounting Style |
Surface Mount |
| Package Length (nominal) (mm) |
24.380 |
| Sample Exception Availability |
N |
| Device Weight (g) |
5.82195 |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
| REACH SVHC |
Freescale REACH Statement |
| Description |
32BIT ON-CHIP CACHE, MMU |
| Additional Features |
Memory Management Unit (MMU) |
| Budgetary Price($US) |
- |
| Maximum Time at Peak Temperature (s) |
40 |
| Moisture Sensitivity Level (MSL) |
1 |
| Export Control Classification Number (US) |
3A991 |
| I/O Operating Voltage (Max) (V) |
5 |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Tape & Reel |
No |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Package Description and Mechanical Drawing |
CQUAD 132 |
| Package Width (nominal) (mm) |
24.380 |
| Pin/Lead/Ball Count |
132 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Peak Package Body Temperature (PPT)(°C) |
260 |