| 系列 |
MCF530x |
| 核心处理器 |
Coldfire V3 |
| 芯体尺寸 |
32-Bit |
| 速度 |
90MHz |
| RAM容量 |
4K x 8 |
| 程序存储器类型 |
ROMless |
| 输入/输出数 |
16 |
| 振荡器型 |
External |
| 连通性 |
EBI/EMI, I²C, UART/USART |
| 工作电压 |
3 V ~ 3.6 V |
| 工作温度 |
-40°C ~ 85°C |
| 周边设备 |
DMA, POR, WDT |
| Internal RAM (kByte) |
4 |
| Timer Features |
Output Compare / Input Capture |
| Timers - Channels |
2 |
| Status |
Active |
| Halogen Free |
Yes |
| I/O Operating Voltage (Max) (V) |
3.3 |
| Leadtime (weeks) |
10 |
| Package Width (nominal) (mm) |
28.000 |
| Timers - Size (bit) |
16 |
| External Memory Supported |
SDRAM |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Micron Size (μm) |
.32 |
| Package Length (nominal) (mm) |
28.000 |
| Total DMA Channels |
4 |
| Chip Selects |
8 |
| Package Thickness (nominal) (mm) |
4.100 |
| Cache (kByte) |
16 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| MPQ Container |
TRAY |
| Ambient Operating Temperature (Min-Max) (°C) |
0 to 70 |
| Device Sample Availability |
09 Dec 2005 |
| External Interrupts |
4 |
| REACH SVHC |
Freescale REACH Statement |
| 2nd Level Interconnect |
e3 |
| Core: Operating Frequency Max (Max) (MHz) |
90 |
| Device Production Availability |
09 Dec 2005 |
| Package Material |
Plastic |
| POQ Container |
BOX |
| Part Number |
MCF5307CAI90B |
| Core: Performance in MIPS |
75 |
| Floor Life |
168 HOURS |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Debug Features |
JTAG |
| Export Control Classification Number (US) |
3A991 |
| Pin/Lead/Ball Count |
208 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Description |
MCF5307 V3CORE 4KSRAM |
| Budgetary Price($US) |
10000 @ $18.32 each |
| I/O Pins |
16 |
| Serial Interface - Type |
UART / I2C |
| Life Cycle Description (code) |
PRODUCT MATURITY/SATURATION |
| Maximum Time at Peak Temperature (s) |
30 |
| Serial Interface - Number of Interfaces |
2 / 1 |
| Timers - Number of Timers |
2 |
| Additional Features |
PLL |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Material Type |
Tested Packaged Device |
| Peak Package Body Temperature (PPT)(°C) |
250 |
| Device Type |
MPU |
| Device Weight (g) |
5.69645 |
| Minimum Package Quantity (MPQ) |
24 |
| Moisture Sensitivity Level (MSL) |
3 |
| Number of Reflow Cycles |
3 |
| Mounting Style |
Surface Mount |
| Package Description and Mechanical Drawing |
FQFP 208 28*28*3.3P0.5 |
| Preferred Order Quantity (POQ) |
120 |
| Sample Exception Availability |
N |