| 系列 |
HCS08 |
| 核心处理器 |
HCS08 |
| 芯体尺寸 |
8-Bit |
| 速度 |
40MHz |
| RAM容量 |
1.5K x 8 |
| 程序存储器类型 |
FLASH |
| 程序存储器容量 |
32KB (32K x 8) |
| EEPROM 大小 |
1K x 8 |
| 输入/输出数 |
25 |
| 振荡器型 |
External |
| 数据转换器 |
A/D 10x10b |
| 连通性 |
I²C, LIN, SCI, SPI |
| 工作电压 |
2.7 V ~ 5.5 V |
| 工作温度 |
-40°C ~ 125°C |
| 周边设备 |
LVD, POR, PWM, WDT |
| Budgetary Price($US) |
10000 @ $2.71 each |
| POQ Container |
BOX |
| Preferred Order Quantity (POQ) |
1250 |
| Supply Voltage (Min-Max) (V) |
2.7 to 5.5 |
| Timers - Size (bit) |
16 / 16 |
| Leadtime (weeks) |
6 |
| Minimum Package Quantity (MPQ) |
1250 |
| Package Material |
Plastic |
| Sample Exception Availability |
Y |
| Description |
32K FLASH, 1K RAM, NO CAN |
| Internal RAM (kByte) |
1.5 |
| Life Cycle Description (code) |
PRODUCT RAPID GROWTH |
| Package Length (nominal) (mm) |
7.000 |
| Package Width (nominal) (mm) |
7.000 |
| Device Sample Availability |
03 Nov 2008 |
| Device Weight (g) |
.18860 |
| Export Control Classification Number (US) |
3A991 |
| Floor Life |
168 HOURS |
| I/O Pins |
26 |
| Material Type |
Tested Packaged Device |
| Micron Size (μm) |
.25 |
| Package Description and Mechanical Drawing |
LQFP 32 7*7*1.4P0.8 |
| Timers - Channels |
4 / 2 |
| Device Type |
MCU |
| 2nd Level Interconnect |
e3 |
| A/D Converter - Bits (bit) |
12 |
| Core: Operating Frequency Max (Max) (MHz) |
40 |
| Package Thickness (nominal) (mm) |
1.600 |
| Timer Features |
Input Capture / Output Compare / PWM / Watchdog |
| Number of Reflow Cycles |
3 |
| Peak Package Body Temperature (PPT)(°C) |
260 |
| RoHS Certificate of Analysis (CoA) |
Download RoHS CoA Report |
| Additional Features |
COP / Low Voltage Detect / POR / Real-Time Clock / Temperature Sensor / Internal Voltage Regulator / Analog Comparator |
| MPQ Container |
BRICK |
| REACH SVHC |
Freescale REACH Statement |
| Serial Interface - Number of Interfaces |
1 / 1 / 1 |
| Serial Interface - Type |
SCI / SPI / I2C |
| Part Number |
MC9S08DN32AMLC |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Internal Flash (kByte) |
32 |
| Status |
Active |
| Bus Frequency (Max) (MHz) |
20 |
| Maximum Time at Peak Temperature (s) |
40 |
| Device Production Availability |
03 Nov 2008 |
| EEPROM (kByte) |
1 |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Material Composition Declaration (MCD) |
Download MCD Report Download MCD Report |
| Halogen Free |
Yes |
| A/D Converter - Channels |
10 |
| Ambient Operating Temperature (Min-Max) (°C) |
-40 to 125 |
| Core: Type |
S08 |
| Moisture Sensitivity Level (MSL) |
3 |
| Tape & Reel |
No |
| Timers - Number of Timers |
1 / 1 |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Maximum Height Above Board (mm) |
1.600 |
| Mounting Style |
Surface Mount |
| Pin/Lead/Ball Count |
32 |