| 系列 |
HC05 |
| 核心处理器 |
HC05 |
| 芯体尺寸 |
8-Bit |
| 速度 |
2.1MHz |
| RAM容量 |
192 x 8 |
| 程序存储器类型 |
OTP |
| 程序存储器容量 |
3.75KB (3.75K x 8) |
| 输入/输出数 |
32 |
| 振荡器型 |
Internal |
| 数据转换器 |
A/D 4x8b |
| 工作电压 |
3 V ~ 5.5 V |
| 工作温度 |
0°C ~ 70°C |
| 周边设备 |
LED, POR |
| Status |
No Longer Manufactured |
| Life Cycle Description (code) |
REMOVED FROM ACTIVE PORTFOLIO |
| Material Type |
Tested Packaged Device |
| Package Length (nominal) (mm) |
52.070 |
| Package Description and Mechanical Drawing |
PDIP 40 |
| Package Thickness (nominal) (mm) |
7.680 |
| Tape & Reel |
No |
| UL94 (plastics flammability test) |
V0: burning stops within 10 seconds on a vertical specimen; no drips allowed |
| Package Material |
Plastic |
| Package Width (nominal) (mm) |
13.970 |
| Application/Qualification Tier |
COMMERCIAL, INDUSTRIAL |
| Part Number |
MC68HC705SR3PE |
| RoHS Certificate of Analysis (CoA) |
Contact Us |
| Description |
8 BIT MCU, 192 BYTES RAM |
| Micron Size (μm) |
1.2 |
| Budgetary Price($US) |
- |
| REACH SVHC |
Freescale REACH Statement |
| 2nd Level Interconnect |
e3 |
| Export Control Classification Number (US) |
EAR99 |
| Material Composition Declaration (MCD) |
Download MCD Report |
| Mounting Style |
Through Hole |
| Harmonized Tariff (US) Disclaimer |
8542.31.0000 |
| Device Weight (g) |
5.95345 |
| Sample Exception Availability |
N |
| Peak Package Body Temperature (PPT)(°C) |
Not Available |