| 产品类型 |
2nd Level Interconnect |
3rd Order Intercept (Typ) (dBm) |
Application/Qualification Tier |
Die Technology |
Export Control Classification Number (US) |
Floor Life |
Frequency (Max) (MHz) |
Frequency Band (Min-Max) (MHz) |
Harmonized Tariff (US) Disclaimer |
Life Cycle Description (code) |
Material Composition Declaration (MCD) |
Micron Size (μm) |
Minimum Package Quantity (MPQ) |
Moisture Sensitivity Level (MSL) |
Noise Figure (Typ) (dB) @ f (MHz) |
P1dB (Typ) (dBm) |
Pin/Lead/Ball Count |
Pin/Lead/Ball Count |
POQ Container |
RoHS Certificate of Analysis (CoA) |
Sample Exception Availability |
Supply Current (Typ) (mA) |
Supply Voltage (Typ) (V) |
Output Power (Typ) (dBm) @ f (MHz) |
Leadtime (weeks) |
Gain (Typ) (dB) @ f (MHz) |
Input 3rd Order Intercept (Typ) (dBm) @ f (MHz) |
Output Intercept Point (Typ) (dBm) @ f (MHz) |
Input P1dB (Typ) (dBm) @ (MHz) |
Modes |
Supply Voltage (Min-Max) (V) |
Biasing |
Bypass Gain (dBm) @ f (MHz) |
Bypass Input 3rd Ord Intercept (Typ) (dBm) @ f (MHz) |
Class |
Halogen Free |
Last Order Date |
Last Ship Date |
Matching |
Material Type |
Maximum Time at Peak Temperature (s) |
Mounting Style |
MPQ Container |
Number of Reflow Cycles |
Package Material |
Peak Package Body Temperature (PPT)(°C) |
REACH SVHC |
Standby Current (Typ) (uA) |
Tape & Reel |
Budgetary Price($US) |
Package Thickness (nominal) (mm) |
Package Length (nominal) (mm) |
Preferred Order Quantity (POQ) |
Device Weight (g) |
Package Description and Mechanical Drawing |
Power Gain (Typ) (dB) @ f (MHz) |
Peak Package Body Temperature (PPT)(°C) |
Package Width (nominal) (mm) |
Device Sample Availability |
Status |
Part Number |
Description |
Application |
Device Production Availability |
LNA Band - Cellular Application |
Thermal Resistance (Spec) (°CW) |
UL94 (plastics flammability test) |